Lux Semiconductors' System-on-Foil technology is designed to reduce the size and improve the performance of microelectronics for spacecraft, aircraft and other applications. Credit: Lux Semiconductors ...

WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

Moving forward in the development of microelectronics manufacturing, several challenges are met in the industry. Driven by miniaturization the footprint reduction, especially for encapsulations, is of ...

Non-destructive inspection techniques play a pivotal role in assuring the integrity and performance of microelectronic packages as device architectures become ever more compact and heterogeneous.

Jet dispensing has emerged as a pivotal non-contact technique for depositing minute volumes of adhesives, solder pastes and encapsulants in the assembly of microelectronic devices. By propelling fluid ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

WEST LAFAYETTE, Ind. — Purdue University, a national leader in microelectronics research and workforce development, will host a workshop to discuss challenges and opportunities related to the future ...

Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...